Chip-packaging company Imbera Electronics announced that it raised $15 million from NorthZone Ventures, Index Ventures and Conor Venture Partners. NorthZone led the round. Imbera is the developer of patented Integrated Module Board technology for 3-D semiconductor packaging
Previously Imbera had raised $2 million in a first institutional round and just under $1 million in seed money before that.
The newly raised money will go to kick start a new high-volume manufacturing operation in Sangsong-ri, South Korea, and to continue Imbera’s embedded technology evolution through its R&D activities located in Espoo, Finland.
According to VentureBeat Risto Touminen, Imbera’s chief technology officer, had worked on the technology as a student at the Helsinki University of Technology since 1999.
You can read more about Imbera’s chip packaging technology at VentureBeat here.
It’s good to see a Nordic VC’s Nordic VCs active, when the Venture Capital industry in Silicon Valley is coughing.
